FPD – HP/CP System
페이지 정보
본문
HP/CP
Chamber
- 각종 재료 Coating후 Dry process(Baking)
- LCD CF & TFT/Touch screen panel etc.
- DB(Dehydration bake) SB(soft bake) HB(hard bake) 공정
- Plate Type :Proximity pin
- Heating Type : Mica heater
- Maintenance : Chamber sliding type
- 온도 Uniformity : ±2°C (@150 °C )
- 이전글FPD – Dispenser 22.01.04
- 다음글FPD – VCD System 22.01.04
